Xeon Processor W-2175 2.5GHz 19.25MB Cache (cd8067303842300)

Introduction

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Processor

Processor manufacturer

Intel

Processor model

W-2175

Processor base frequency

2.5 GHz

Processor cores

14

Processor socket

LGA 2066 (Socket R4)

Processor lithography

14 nm

Processor threads

28

System bus rate

8 GT/s

Processor operating modes

64-bit

Processor boost frequency

4.3 GHz

Processor cache

19 MB

Thermal Design Power (TDP)

140 W

Box

N

Cooler included

N

Bus type

QPI

Memory bandwidth supported by processor (max)

85.3 GB/s

Processor codename

Skylake

Processor ARK ID

130046

Memory

Maximum internal memory supported by processor

512 GB

Memory types supported by processor

DDR4-SDRAM

Memory clock speeds supported by processor

1600,1866,2133,2400,2666 MHz

Memory channels

Quad-channel

ECC

Y

Graphics

On-board graphics card

N

Features

Execute Disable Bit

Y

Idle States

Y

Thermal Monitoring Technologies

Y

Market segment

Server

Maximum number of PCI Express lanes

48

PCI Express slots version

3.0

PCI Express configurations

1x16,1x4,1x8

Supported instruction sets

SSE4.2,AVX,AVX 2.0,AVX-512

Scalability

1S

Physical Address Extension (PAE)

Y

CPU configuration (max)

1

Embedded options available

N

Physical Address Extension (PAE)

46 bit

PCI Express CEM revision

3.0

Harmonized System (HS) code

8542310001

Export Control Classification Number (ECCN)

5A992C

Commodity Classification Automated Tracking System (CCATS)

G077159

Processor special features

Intel® Hyper Threading Technology (Intel® HT Technology)

Y

Intel® Identity Protection Technology (Intel® IPT)

Y

Intel® Turbo Boost Technology

2.0

Intel Flex Memory Access

N

Intel® AES New Instructions (Intel® AES-NI)

Y

Enhanced Intel SpeedStep Technology

Y

Intel Trusted Execution Technology

Y

Intel® Memory Protection Extensions (Intel® MPX)

Y

Intel® Speed Shift Technology

Y

Intel® Transactional Synchronization Extensions

Y

Intel Enhanced Halt State

Y

Intel VT-x with Extended Page Tables (EPT)

Y

Intel Demand Based Switching

Y

Intel® Secure Key

Y

Intel TSX-NI

Y

Intel® OS Guard

Y

Intel Software Guard Extensions (Intel SGX)

N

Intel 64

Y

Intel Identity Protection Technology version

1.00

Intel Secure Key Technology version

1.00

Intel Virtualization Technology (VT-x)

Y

Intel Virtualization Technology for Directed I/O (VT-d)

Y

Intel TSX-NI version

1.00

Conflict-Free processor

Y

Intel Turbo Boost Max Technology 3.0

N

Intel® Optane™ Memory Ready

N

AVX-512 Fused Multiply-Add (FMA) units

2

Intel® Boot Guard

Y

Intel® Volume Management Device (VMD)

Y

Intel® vPro™ Platform Eligibility

Y

Technical details

Bus type units

GT/s

Launch date

Q3'17

Processor cache

19456 KB

Product type

Processor

Status

Launched

Maximum memory

512 GB

Processor brand name

Intel Xeon

Supported memory types

DDR4-SDRAM

Last change

63903513

Product family

Intel Xeon Processors

Intel® Speed Shift Technology version

1.00

Intel® Volume Management Device (VMD) version

1.00

Bus speed

8 GT/s

Weight & dimensions

Processor package size

45mm x 52.5mm

Other features

Maximum internal memory

512 GB

Maximum internal memory

524288 MB